Tingjun Chen received Facebook Fellowship
FlexICoN PhD student Tingjun Chen has been named a 2019 Facebook Fellow. Tingjun received the fellowship in the area of networking and connectivity. His research interests are in future wireless networks and systems, including the Internet-of-Things (IoT), energy-harvesting networks, full-duplex wireless, massive antenna systems, optical-wireless networks, and millimeter-wave (mmWave) networks. In particular, his research focuses on the design and optimization of physical (PHY) layer technologies and medium access control (MAC) layer protocols and their experimental performance evaluation, using custom-designed prototypes and testbeds. He is the student co-lead of the Columbia Full-duplex wireless: from Integrated Circuits to Networks (FlexICoN) project and is involved in the design and deployment of the NSF PAWR COSMOS testbed.
The Facebook Fellowship Program recognizes promising doctoral students who are engaged in innovative and relevant research in areas related to computer science and engineering. The 2019 fellowship program selected 21 fellows out of more than 900 applicants worldwide. Each fellow will receive up to two years of tuition and fees, a stipend of $37,000 each year, up to $5,000 in conference travel support, and the opportunity to attend Facebook’s annual fellowship summit.
“Facebook’s generous fellowship,” says Tingjun, “will help support my research, much of which is closely aligned with the company’s research in networking and connectivity, with a special focus on future wireless networks. It will also support my travel to major conferences to present our work and communicate with other researchers. I also look forward to the annual fellowship summit, where I’ll be able to interact with the other fellows and learn about their exciting research. I am particularly honored to be the first Columbia University recipient since 2012.”
Tingjun received his BEng in electronic engineering from Tsinghua University, China, in 2014, and his MS in electrical engineering from Columbia in 2015. He has received a number of awards, including the Wei Family Private Foundation Fellowship, the Columbia Electrical Engineering Armstrong Memorial Award and Millman Award, the Columbia Engineering Oscar and Verna Byron Fellowship, as well as the ACM CoNEXT 2016 Best Paper Award. In September 2018, he was one of 200 young researchers from around the world selected to attend the sixth Heidelberg Laureate Forum.